Multiphysics issues are no longer a late-stage problem. Multi-die designs introduce tightly coupled electrical, thermal, electromagnetic, and electromechanical challenges that impact performance and reliability. This eBook shows why multiphysics analysis must move earlier in the design flow, and how a unified approach enables continuous validation from exploration through signoff.

What You’ll Learn:
• Why multiphysics effects increase in multi-die designs
• How to move analysis earlier in the design flow
• Methods to model thermal, power, and SI interactions
• How unified workflows improve design accuracy